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| Stamoulis, Georgios; Carrere, Nicolas; Cognard, J. Y.; Davies, Peter; Badulescu, Claudiu. |
| The use of adhesively bonded structures is widespread in various engineering fields, as they provide many advantages over other conventional types of mechanical joints. In this study, we use a crash optimized, single-component epoxy adhesive (SikaPower®-498 made of a rigid epoxy matrix containing soft, tough polymer inclusions that provide additional ductility to the adhesive layer) at a constant layer thickness of 0.5 mm to bond metallic substrates. We investigate its fracture properties under mode I and mixed-mode I/II loadings, in order to obtain the full fracture envelope. Mode I loading has been performed using the ISO 25217 standard: the substrates were designed according to the TDCB (Tapered Double Cantilever Beam) geometry, and the fracture... |
| Tipo: Text |
Palavras-chave: Fracture toughness; Linear Elastic Fracture Mechanics (LEFM); Adhesive bonding; Finite Element Analysis (FEA); Failure criterion. |
| Ano: 2014 |
URL: http://archimer.ifremer.fr/doc/00181/29273/27685.pdf |
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